Sputtering of magnetron sputtering coating machine design

 

  Today we see a lot of products in cities poiso, has high glossiness, actually these products are mostly for the coating processing, make the surface with high gloss, is also meaningful for the packing of the product. And, as a kind of typical coating machinery, now there is a certain type of splashing in this type of equipment control sputtering coating machine, and this kind of coating has the characteristics of what? To introduce the following.
  Control sputtering coating machine target the splash splashing area increase, resulting in a loss on the surface of the target power density to solve. So for such as magnetron sputtering cathode magnetic field design has been in constant progress. One more representative, such as: circular planar magnetron sputtering source, through the reasonable design of magnetic field, make the formation of the runway through the target surface center vacuum equipment, using mechanical transmission device, rotating magnet realize comprehensive sputtering target surface; Rectangular plane magnetron sputtering source, through the vacuum coating unit and drive mechanism in the back of target a diamond or quincunx exercise, make the whole target material utilization rate of 61%; By adjusting of magnetic circuit, the realization of target surface low pressure etching in an all-round way.