PVD Vacuum Coating Deposition-Thermal Evaporation Coating Equipments
PVD vacuum coating deposition techniques have magnetron sputtering, cathodic arc ion plating, reactive ion plating reaction. Because gas turbine blade in working condition thermal shock, corrosion coating and thermal structure of the force between the blade base is very important. Usually in order to improve the bonding strength of the coating and the substrate, prior to deposition of the multi-leaf is preheated, heat-treated after deposition. Heating temperature control at about 950 ℃, heating time around 2h. Cathodic arc ion plating deposition MCrAIY hot corrosion coating on a gas turbine blade coating machine level, target tubular MCrAIY alloys. Post-deposition heat treatment, a long production cycle. There is also a small arc source arc ion plating after adding high-temperature diffusion, and achieved certain results.
An arc Ion vacuum coating equipment - plating process can be achieved combining step, both the diffusion layer can be obtained, they can obtain a dense thermal corrosion properties of the vacuum coating. Process is as follows:
Ion - plating. Leaf base - Ni-base alloy CH220; infiltration - Plating - using CoCrAITaY target.
(1) alloying. Bias: 850 ~ 1000V; temperature: about 920 ℃, with photoelectric pyrometer temperature; holding time: 20min.
(2) obtain deposits. Bias voltage: 200V, 250V, 300V; Temperature: were 600 ℃, 700 ℃, 800 ℃; deposition time: 150min.
Arc Ion - plating deposition coating 30μm CoCrAITaY the time of 3h, and the total time of magnetron sputtering coating 50μm for 8h. Wherein a considerable amount of time to preheat and post-processing.
The advantages of sputtering coating filmSputtering vacuum coating method, because of its different coating methods, the effect of the same film coating material prepared will be different, although the naked eye can not see it, but it does have certain advantages. Film thickness, good stability, due to the sputtering target film thickness and discharge currents have a great relationship, the higher the current, the greater the sputtering efficiency, within the same time, the thickness of the coating layer is relatively big, as long as the current value of a good control, you need more than a thick plating, or more thin layers can be, of course, this thickness is within the allowable range, and control the current, regardless of how many times repeated plating, the film thickness is not will change the thickness of the film thickness can be attributed to the stability of good controllability and repeatability.
Film with strong, during the sputtering process, some electrons strike the substrate surface, and activating the surface atoms, and produce clean effect, the energy energy-plated material obtained by sputtering evaporation obtained higher than 1 when the two orders of magnitude, such a plating material having a high atomic impact energy to the substrate surface, more energy can be transferred to a substrate, produce more heat, so that the activation of atoms by electrons accelerated motion, and the part plated metal atom earlier fused together with each other, other plating material atom tight with successively deposited film, strengthening the binding force of the film and the substrate.
A wide range of plating material, due to sputtering by argon ion bombardment makes high speed plating material sputtered out, unlike Evaporation and restrictions due to the melting point of only using a relatively low melting point metal plating, sputtering and almost all the solid material can become coated material.
You can see from the above points Sputtering is indeed better than the evaporation vacuum coating effect, a different principle determines the thickness of the film is more stable sputtering, combined with stronger, broader-plated material.
