2016年11月6日星期日

Evaporation magnetron sputtering coating machine characteristic parameters

Evaporation magnetron sputtering coating machine characteristic parameters

Splash control sputter coating vendors would produce evaporation magnetron sputtering coating machine
The evaporation magnetron sputtering coating machine equipment using the magnetron sputtering cathode glow discharge (target) ionization of atoms deposited on the substrate (physical vapor deposition (PVD) and vacuum melting using resistance heating wire or metal molecular evaporation, the base material, such as following from plastic surface metallization, using specific thin-film coating products not conductive and electromagnetic shielding effect, in order to meet the current mobile phone of the high-end electronics manufacturing industry standards;
Evaporation magnetron sputtering coating machine equipment, the concentration of plasma processing, high-end magnetron sputtering, cathode resistor evaporating &coating equipment, large loading capacity and automation control technology, reliable operation, good repeatability, high deposition rate is fast, good adhesion, film quality is exquisite, etc., made of plated film density high hardness, low friction coefficient, can keep the original surface is bright and clean, has good toughness, not easy to broken off. Evaporation magnetron sputtering coating machine automatic control equipment to realize coating process. In the substrate surface by using vacuum coating method for coating, evaporation magnetron sputtering coating machine has low production cost, product qualified rate is high, the green environmental protection and other characteristics, is mainly used in computers, cell phones, high-end industrial, household electronic appliances, aviation, etc, to composite metal film, alloy plating film, transparent (translucent) film, non-conductive film, such as electromagnetic shielding film and special film layer.

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